Detailed introduction of BGA PCB manufacturing

BGA is an abbreviation for Ball Grid Array and refers to a surface mount package for IC circuits. The circuit board manufacturer permanently mounts the circuit board with BGA holes to the microprocessor This packaging method has the advantage that compared with DIP assembly, BAG can have more interconnection pins and each pin has a solder ball. The BGA’s connections are all distributed in a uniform surface grid or matrix between components. Therefore, electronics manufacturers have a soft spot for manufacturing BGA PCB boards, and we will introduce it in more detail next:

Advantages of using BGA PCB board

• In line with the miniaturization trend

The BGA holes on the PCB can reduce the number of components used on the circuit board, greatly improve the utilization of the board surface, and enhance the performance of the PCBA.

• Enhance the new performance of the circuit board

The size of the PCB manufactured based on BGA is smaller than that of other circuit boards, and the heat will not accumulate on the board surface. Designers don’t need to think too much about heat dissipation, because the heat dissipation performance of BGA PCB itself is very good. Designers attach a silicon backplane to the board, and the back of the board connects to the top of the package, which is one of the best ways to dissipate heat.Rigid PCB cannot be bent and folded, which enhances the electrical performance well.

• BGA saves the cost of PCBmanufacturing

Package pads are generally relatively large, which makes it less likely for manufacturers to make mistakes during soldering, improves the yield rate and reduces manufacturing costs. Conversely, when you need a quick turnaround, tiny solder joints are very error-prone due to fatigue, which will lead to rework.

FS Technology’s BGA PCB Manufacturing Technology

FS Technology is capable of BGA assembly and manufacturing. According to the ability of the production workshop, in order to manufacture a perfect circuit board, the diameter of the pad (pictured below) must be greater than 0.25mm, the spacing between the traces must be greater than 0.15mm, and the distance between BGA and Pad must be greater than 0.15mm.

Of course, the above is a low-cost manufacturing solution, you can choose advanced manufacturing, for which we need to charge an additional fee. Whether it is PCB or PCBA service, the defective rate is the main factor leading to cost increase, we do not recommend you to choose a risky manufacturing solution.